Teradek Bond Pro Module CoProcessor Firmware 7.1.6 Download

Posted at April 27, 2024 by PCI-DB Team

Teradek Bond Pro Module CoProcessor Firmware 7.1.6 Description

Fixes:

- Fixed audio dropout during RTMP start/stop broadcast
- Bond now auto-detects Pantech UML295 modem
- Bonding Network Interface Settings available for Link & Edge
- Fixed Web interface bug when switching Bond Modes
- Fixed analog audio issue when switching from embedded audio
- Front panel now displays WiFi changes correctly
- Fixed aspect radio on the Quickview stream

  It is highly recommended to always use the most recent driver version available.

Try to set a system restore point before installing a device driver. This will help if you installed an incorrect or mismatched driver. Problems can arise when your hardware device is too old or not supported any longer.

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